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Published on:2021-05-06 10:41:21Views:6782【Smallinlarge】
Application fields
It is used for grinding and polishing of optical elements, crystals, metal and glass materials, and also for grinding and polishing of special materials, such as the following polishing of silicon, zinc selenide, and gallium arsenide.
White damping cloth polishing pad:
With excellent interconnected microporous structure, it has outstanding removal rate, polishing stability, and wear resistance in case of rough polishing. Together with grinding and polishing fluid series products, it is used for rough polishing or medium polishing of materials or workpieces such as ceramics, gallium arsenide, indium phosphide, hard disc, optical glass, metal products, sapphire substrate wafer, and silicon carbide wafer, so as to obtain the wafer surface without defects.
Appearance |
White |
Shape |
Circular |
Thickness |
T0.5-3.0mmn |
Shore Hardness (A) |
70-95±2 |
Groove |
T&U-shaped Groove 10-20mm |
Groove depth |
0.8±0.2mm |
Groove Width |
1.8±0.2mm |
Density |
0.47±0.03g/mm3 |
Inner Adhesion |
2800 (gf/20mm) |
Outer adhesion |
2600 (gf/20mm) |
Percentage of Elongation (Compression Ratio) |
6.3±3% |
Gum |
3M imported PET double-sided tape |
Regular Specification |
Φ127/Φ180/Φ610/Φ710/Φ820/Φ920/Φ980/Φ1100-Φ1280mm |
Advantages of white polishing pad:
1) It has high removal rate, stable quality, good wear resistance;
2) With moderate softness and elasticity, it can avoid scratches effectively;
3) A large amount of polishing fluid can be stored in the intervillous space on the surface, so as to improve the polishing efficiency;
4) It is easy to tear off the gum without the adhesive residual, so it can be used easily.
Instructions for use:
1. Tear off the release paper on the back of the polishing pad, and attach the polishing pad uniformly onto the operating surface of the bench, and pay attention not to keep any bubbles;
2. Use together with alumina or silicon oxide series grinding fluid;
3. Please clean with clean water after each use.
Black damping cloth polishing pad
With excellent interconnected microporous structure, it has outstanding polishing stability and wear resistance in case of polishing. Together with grinding and polishing fluid series products, it is used for high planarization super-precision polishing of wafer, sapphire, quartz, glass, metal, and ceramic with the accuracy up to 0.0002 after polishing, so as to achieve the perfect mirror effect.
Appearance |
Black |
Shape |
Circular |
Thickness |
T0.5-3.0mmn |
Shore Hardness (A) |
70-90±2 |
Groove |
Groove 0.5-20mm |
Groove depth |
0.5±0.2mm |
Groove Width |
1.8±0.2mm |
Density |
0.60±0.05g/mm3 |
Inner Adhesion |
2800 (gf/20mm) |
Outer adhesion |
2600 (gf/20mm) |
Percentage of Elongation (Compression Ratio) |
6.3±3% |
Gum |
3M imported PET double-sided tape |
Regular Specification |
Φ127/Φ180/Φ610/Φ710/Φ820/Φ920/Φ980/Φ1100-Φ1280mm |
Advantages of black polishing pad:
1) It has stable quality and good wear resistance;
2) With moderate softness and elasticity, it can avoid scratches effectively;
3) A large amount of polishing fluid can be stored in the intervillous space on the surface, so as to improve the polishing efficiency;
4) It is easy to tear off the gum without the adhesive residual, so it can be used easily.
Instructions for use:
1. Tear off the release paper on the back of the polishing pad, and attach the polishing pad uniformly onto the operating surface of the bench, and pay attention not to keep any bubbles;
2. Use together with alumina or silicon oxide series grinding fluid;
3. Please clean with clean water after each use.