[Notice on Exhibition] Shenzhen Zhongji Micro Material will participate in the International Optoelectronics Expo

From September 16 to 18, 2021, Shenzhen Zhongji Micro Material will participate in the “CIOE2021 23^rd China International Optoelectronics Expo” held in China Shenzhen International Convention and Exhibition Center. The main products to be exhibited by our Company include the cutting, grinding and polishing materials for processing of metal and non-metal hard and brittle materials, and the fine chemical products for grinding and polishing, including but not limited to diamond micro-powder, alumina powder, agglomerated diamond grinding fluid, alumina polishing fluid, silica (CMP) polishing fluid, and auxiliary grinding pad, polishing pad, etc. You are welcome to visit the exhibition.

Name of Exhibition: CIOE2021 23^rd China International Optoelectronics Expo

Time of Exhibition: From September 16 to September 18, 2021

Venue: Shenzhen International Convention and Exhibition Center (Bao’an New Hall)

Booth No.: 3D41

Driving Navigation: Hall No.3, Shenzhen International Convention and Exhibition Center (Bao’an)

During this period, we will cooperate with industry peers to jointly carry out a distinctive “Technical Seminar for Cutting, Grinding and Polishing of Hard and Brittle Materials – Special Session at Shenzhen Optoelectronics Expo” with the proposed theme of “Solutions for Cutting, Grinding and Polishing of Sapphire Wafers”. This seminar will be reported online and offline simultaneously. We sincerely invite you to observe and discuss.

Your presence and guidance are requested!