OFC MicroMaterial(Shenzhen)Co.,Ltd will deliver a speech at the "SEMI Compound Semiconductor Industry Technology and Development Forum" held in Wuxi, Jiangsu Province on January 26, 2024, with the theme of "SiC substrate cutting and polishing process Direction and localization process". The forum is an important event organized by SEMI, focusing on the latest technologies, market trends and developments in the compound semiconductor industry.

This presentation will introduce the cutting and polishing process direction of SiC substrate, including key technologies such as cutting, grinding and polishing. At the same time, he will also share the experience and technical accumulation of Shenzhen Zhongji New Materials Co., Ltd. in the development and production of SiC substrates. In addition, he will explore the status quo and future development trends of SiC substrate localization, and how to promote the localization process of SiC substrate through technological innovation and market expansion.

At that time, the new material of China Machine will also debut with star products and solutions, we look forward to your arrival!

Registration link

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https://mp.weixin.qq.com/s/S9x-sV2Nw91L6JaSIKyfqA